TY - CHAP
T1 - Analytical and Numerical Methods for Modeling the Thermomechanical and Thermophysical Behavior of Microstructured Materials
AU - Böhm, Helmut J.
AU - Pahr, Dieter H.
AU - Daxner, Thomas
N1 - Publisher Copyright:
© 2010, CISM, Udine.
PY - 2010
Y1 - 2010
N2 - Basic application-related aspects of two important groups of approaches to continuum micromechanics of inhomogeneous materials are presented, viz., mean field schemes and methods based on discrete microstructures. Emphasis is put on handling both thermomechanical and thermal conduction problems. On this basis some issues and applications of continuum micromechanics are discussed. They comprise incremental Mori-Tanaka methods for finite strains, modeling of the thermomechanical and thermal conduction behavior of diamond particle reinforced metal matrix composites, windowing estimates for the macroscopic linear responses of inhomogeneous media, and modeling of the mechanical behavior of cellular materials.
AB - Basic application-related aspects of two important groups of approaches to continuum micromechanics of inhomogeneous materials are presented, viz., mean field schemes and methods based on discrete microstructures. Emphasis is put on handling both thermomechanical and thermal conduction problems. On this basis some issues and applications of continuum micromechanics are discussed. They comprise incremental Mori-Tanaka methods for finite strains, modeling of the thermomechanical and thermal conduction behavior of diamond particle reinforced metal matrix composites, windowing estimates for the macroscopic linear responses of inhomogeneous media, and modeling of the mechanical behavior of cellular materials.
UR - http://www.scopus.com/inward/record.url?scp=85052441297&partnerID=8YFLogxK
U2 - 10.1007/978-3-211-99685-0_5
DO - 10.1007/978-3-211-99685-0_5
M3 - Chapter in book/report
AN - SCOPUS:85052441297
T3 - CISM International Centre for Mechanical Sciences, Courses and Lectures
SP - 167
EP - 223
BT - CISM International Centre for Mechanical Sciences, Courses and Lectures
PB - Springer International Publishing AG
ER -